Laser microjet cutting (LMJ) equipment can be used in the semiconductor industry

Short Description:

Laser microjet technology (LMJ) is a laser processing method that combines laser with a water jet “as thin as a hair”, and precisely guides the laser beam to the processing position through the pulse total reflection in the micro-water jet in a way similar to traditional optical fiber. The water jet continuously cools the cutting area and effectively removes processing debris.


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Advantages of LMJ processing

The inherent defects of regular laser processing can be overcome by the smart use of laser Laser micro jet (LMJ) technology to propagate the optical characteristics of water and air. This technology allows the laser pulses fully reflected in the processed high purity water jet in an undisturbed manner to reach the machining surface as in optical fiber. 

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The main features of LMJ technology are:

1. The laser beam is a columnar (parallel) structure.

2. The laser pulse is transmitted in the water jet like an optical fiber, without any environmental interference.

3. The laser beam is focused in the LMJ equipment, and the height of the machined surface does not change during the entire processing process, so it does not need to continue focusing with the change of the processing depth during the processing.

4. Clean the surface continuously.

micro-jet laser cutting technolgoy (1)

5. In addition to the ablation of the workpiece material by each laser pulse, every single unit time from the beginning of each pulse to the next pulse, the processed material is in the real-time cooling water state for about 99% of the time, which almost eliminates the heat affected zone and the remelt layer, but maintains the high efficiency of the processing.

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General specification

LCSA-100

LCSA-200

Countertop volume

125 x 200 x 100

460×460×300

Linear axis XY

Linear motor. Linear motor

Linear motor. Linear motor

Linear axis Z

100

300

Positioning accuracy μm

+ / - 5

+ / - 3

Repeated positioning accuracy μm

+ / - 2

+ / - 1

Acceleration G

0.5

1

Numerical control

3-axis

3-axis

Laser

 

 

Laser type

DPSS Nd: YAG

DPSS Nd: YAG, pulse

Wavelength nm

532/1064

532/1064

Rated power W

50/100/200

200/400

Water jet

 

 

Nozzle diameter μm

25-80

25-80

Nozzle pressure bar

100-600

0-600

Size/Weight

 

 

Dimensions (Machine) (W x L x H)

1050 x 800 x 1870

1200 x 1200 x 2000

Dimensions (control cabinet) (W x L x H)

700 x 2300 x 1600

700 x 2300 x 1600

Weight (equipment) kg

1170

2500-3000

Weight (control cabinet) kg

700-750

700-750

Comprehensive energy consumption

 

 

Input

AC 230 V +6%/ -10%, unidirectional 50/60 Hz ±1%

AC 400 V +6%/-10%, 3-phase50/60 Hz ±1%

Peak value

2.5kVA

2.5kVA

Join

10 m power cable: P+N+E, 1.5 mm2

10 m power cable: P+N+E, 1.5 mm2

Semiconductor industry user application range

≤4 inches round ingot

≤4 inches ingot slices

≤4 inches ingot scribing

 

≤6 inches round ingot

≤6 inch ingot slices

≤6 inches ingot scribing

The machine meets the 8-inch circular/slicing/slicing theoretical value, and the specific practical results need to be optimized cutting strategy

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micro-jet laser cutting technolgoy (1)
micro-jet laser cutting technolgoy (2)

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