Practical Guide to Using and Selecting Silicon Carbide (SiC) Focus Rings

In semiconductor manufacturing, silicon carbide (SiC) has become a preferred material in high-temperature processes like CVD and MOCVD due to its exceptional thermal stability and chemical inertness. Among the critical components used in these environments, the focus ring plays a key role in stabilizing gas flow, defining the deposition area, and improving thin film uniformity. This article provides a practical overview of how SiC focus rings are used and what to consider when selecting one for your process.

1. What Does a Focus Ring Do?

The focus ring is typically installed between the susceptor and the wafer, and its shape and material have a direct impact on process stability. Its primary functions include:

  • Gas Flow Regulation: It helps guide process gases to ensure even distribution and minimize edge effects.

  • Deposition Uniformity: By defining the active deposition area, it enhances film thickness consistency, particularly at wafer edges.

  • Component Protection: It acts as a shield to prevent deposition or corrosion on critical components such as the susceptor or baseplate.

In processes like MOCVD, the precision and thermal behavior of the focus ring directly affect wafer yield and consistency.

 

2. Why Use Silicon Carbide?

As a third-generation semiconductor material, silicon carbide offers high thermal conductivity, a high melting point, excellent mechanical strength, and outstanding corrosion resistance. Compared with traditional materials such as quartz or graphite, SiC-based focus rings offer several advantages:

  • Exceptional High-Temperature Tolerance: Suitable for sustained operation in high-temperature environments.

  • Stable Surface Chemistry: Reduces risk of contamination or unwanted reactions with process gases.

  • Extended Lifespan: Requires less frequent replacement, reducing maintenance costs and downtime.

High-purity SiC (with impurity levels <5 ppm) that has undergone advanced surface treatment is especially well-suited for processes with stringent cleanliness requirements.

 

3. Selection Guidelines

When choosing a focus ring, it’s important to evaluate process conditions, tool configuration, and material compatibility:

  1. Dimensional Fit: Must align precisely with chamber geometry and wafer size to ensure optimal gas flow control.

  2. Thermal Expansion Compatibility: Select materials with thermal expansion coefficients that match adjacent components to avoid stress or distortion.

  3. Optional Coatings: For processes involving corrosive gases, surface coatings such as TaC can improve durability.

  4. Modular Designs: In applications requiring frequent replacement, modular or detachable focus rings can improve serviceability and reduce tool downtime.

 

4. Usage Considerations

  • Always clean focus rings thoroughly before installation to avoid particle contamination.

  • Ensure proper installation to prevent damage or stress during thermal cycling.

  • Periodically inspect for surface wear or dimensional changes, as degradation may affect deposition uniformity.

  • In corrosive process environments, routinely evaluate the integrity of protective coatings.

 

5. Application Results and Feedback

In several high-end LED and power device production lines, high-purity SiC focus rings have delivered over a 5% improvement in film thickness uniformity and significantly reduced maintenance frequency. This has contributed to more stable process conditions and better overall yield.

 

Author: Semicera

References:The Role of Focus Rings in MOCVD Systems – Oxford Instruments

 


Post time: Jan-29-2026