The AMAT 200mm Wrap Around Quartz Cover (0200-09177) is a high-purity fused quartz component designed for use in 200mm semiconductor wafer processing equipment, particularly within CVD and plasma etching chambers.
Manufactured to meet stringent semiconductor-grade standards, this quartz cover functions as a critical protective and process-stabilizing component inside the reaction chamber. Its wrap-around design enables comprehensive shielding of sensitive internal structures, ensuring improved process consistency and reduced contamination risks.
At Semicera Semiconductor, this component is engineered with ultra-high purity quartz material (>99.99% SiO₂) and precision fabrication techniques to ensure compatibility with leading equipment platforms such as Applied Materials systems.
Key Specifications:
|
Product Name |
Wrap Around Quartz Cover |
|
Part Number |
0200-09177 |
|
Wafer Size Compatibility |
200mm (8-inch) |
|
Material |
High Purity Fused Quartz |
|
Application |
Semiconductor CVD / Etch Chambers |
|
Category |
Quartz Consumable / Chamber Protection Component |
2. Structure and Design Features
2.1 Wrap-Around Geometry
Unlike conventional flat quartz plates, this component features a wrap-around (enclosure-type) structure, designed to partially or fully surround critical chamber regions such as:
● Electrostatic Chuck (ESC) perimeter
● Heater / pedestal assembly
● Chamber sidewall interfaces
This geometry enables enhanced spatial coverage, effectively isolating sensitive components from direct plasma exposure.
2.2 High-Purity Quartz Construction
The cover is fabricated using semiconductor-grade fused quartz, offering:
● Ultra-low metallic impurity levels
● Excellent thermal stability (up to ~1000°C+)
● High resistance to plasma-induced erosion
● Superior dielectric properties
These characteristics are essential for maintaining process integrity in high-temperature and plasma-intensive environments.
3. Core Functions in Semiconductor Processing
3.1 Chamber Protection (Primary Role)
The quartz cover acts as a first-line barrier between the process environment and critical chamber hardware.
It protects against:
● Plasma bombardment
● Reactive gases (e.g., fluorine-based, chlorine-based chemistries)
● Thermal stress
By preventing direct exposure, it significantly extends the service life of expensive chamber components.
3.2 Contamination Control
In advanced semiconductor manufacturing, metal contamination must be strictly controlled.
The use of high-purity quartz enables:
● Minimal impurity introduction
● Reduced risk of wafer contamination
● Compliance with cleanroom process standards
This is particularly critical in:
● Thin film deposition (PECVD, LPCVD)
● Plasma etching processes
3.3 Plasma Stability and Process Uniformity
The wrap-around structure contributes to:
● Stable plasma confinement
● Reduced edge effects
● Improved wafer edge uniformity
By optimizing the internal chamber environment, it helps maintain:
● Consistent deposition/etch rates
● Repeatable process performance
