Solid-State Piezoelectric Cooling Module

The Semicera Solid-State Piezoelectric Cooling Module is an advanced thermal management solution designed for next-generation compact electronics.

Unlike traditional rotary fans, this module utilizes piezoelectric-driven ultrasonic vibration to generate high-speed airflow in an ultra-thin, fully solid-state structure.

It is ideal for applications requiring silent operation, minimal thickness, and high reliability, making it a strong alternative to conventional cooling systems.

Key Features

• Ultra-Thin Design: Thickness as low as 2.5 mm, enabling integration into compact devices
• Silent Operation: No rotating components, near-zero acoustic noise
• High Back Pressure Performance: Up to 1750 Pa, ensuring effective airflow in confined spaces
• Efficient Heat Dissipation: Single module cooling capacity up to 5W+
• Solid-State Reliability: No mechanical wear, long operational lifespan
• Environmental Protection: Sealed structure supporting dustproof and waterproof design (up to IP68 level)
• Smart Thermal Response: Integrated thermal sensing for adaptive performance optimization 

Technical Specifications

Working Principle

The Semicera cooling module operates based on piezoelectric actuation and airflow modulation:

• Electrical excitation drives the piezoelectric ceramic layers
• The structure generates ultrasonic vibration
• Internal air is periodically compressed and accelerated
• High-speed airflow is directed toward the heat source
• Heat is removed through forced convection

This mechanism enhances heat transfer by disrupting the thermal boundary layer, significantly improving cooling efficiency compared to passive solutions.

Structural Design

1. Piezoelectric Actuator

• High-performance PZT ceramics (high d33 coefficient)
• Multi-layer polarization for bidirectional bending
• Composite reinforcement layer for durability

2. Airflow Channel

• Dual-channel airflow design for higher efficiency
• Optimized inlet and outlet geometry
• Internal pressure-guided flow path

3. Mechanical Integration

• Interference-fit mounting structure
• Fully enclosed design for environmental protection
• Stress-isolated architecture to extend lifespan 

Applications

The Semicera piezoelectric cooling module is widely applicable in:

• Ultrabooks and laptops
• Solid-state drives (SSD)
• Mini PCs and embedded systems
• Smartphones and tablets
• Wearable devices
• AI edge computing hardware

Simulation & Integration Support

At Semicera, we provide engineering support for system-level integration, including:

• Thermal simulation (CFD analysis)
• Airflow path optimization
• PQ curve-based performance evaluation
• Customized cooling solutions for specific device layouts

Advantages Over Traditional Fans

Why Choose Semicera

Semicera combines advanced materials expertise with cutting-edge thermal engineering to deliver:

• High-performance cooling solutions
• Reliable solid-state designs
• Custom engineering support
• Scalable solutions for future electronics

Contact Semicera today to learn how our solid-state piezoelectric cooling modules can enhance your product performance and thermal efficiency.