Solid-State Piezoelectric Cooling Module

Short Description:

Semicera piezoelectric cooling module delivers ultra-thin, silent, and high-efficiency thermal management. Featuring solid-state airflow technology, high back pressure, and compact design, ideal for laptops, SSDs, mobile devices, and advanced electronics cooling.

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Product Detail

Product Tags

The Semicera Solid-State Piezoelectric Cooling Module is an advanced thermal management solution designed for next-generation compact electronics.

Unlike traditional rotary fans, this module utilizes piezoelectric-driven ultrasonic vibration to generate high-speed airflow in an ultra-thin, fully solid-state structure.

It is ideal for applications requiring silent operation, minimal thickness, and high reliability, making it a strong alternative to conventional cooling systems.

Key Features

Ultra-Thin Design: Thickness as low as 2.5 mm, enabling integration into compact devices
Silent Operation: No rotating components, near-zero acoustic noise
High Back Pressure Performance: Up to 1750 Pa, ensuring effective airflow in confined spaces
Efficient Heat Dissipation: Single module cooling capacity up to 5W+
Solid-State Reliability: No mechanical wear, long operational lifespan
Environmental Protection: Sealed structure supporting dustproof and waterproof design (up to IP68 level)
Smart Thermal Response: Integrated thermal sensing for adaptive performance optimization

Technical Specifications

Parameter	Value
Product Name	Semicera Piezoelectric Cooling Module
Cooling Technology	Piezoelectric Ultrasonic Airflow
Dimensions	27.5 mm × 41.5 mm
Thickness	2.5 mm
Weight	~7 g
Working Power	1.4 W
Cooling Capacity	≥5 W per module
Maximum Back Pressure	Up to 1750 Pa
Airflow Velocity	Up to 200 km/h (internal airflow acceleration)
Noise Level	Near silent
Protection Level	IP68 (design dependent)
Material	PZT ceramic + composite layer
Drive Mode	High-frequency AC excitation
Operating Frequency	Ultrasonic range (typically 20–100 kHz)
Lifetime	Long-life solid-state operation

Working Principle

The Semicera cooling module operates based on piezoelectric actuation and airflow modulation:

Electrical excitation drives the piezoelectric ceramic layers
The structure generates ultrasonic vibration
Internal air is periodically compressed and accelerated
High-speed airflow is directed toward the heat source
Heat is removed through forced convection

This mechanism enhances heat transfer by disrupting the thermal boundary layer, significantly improving cooling efficiency compared to passive solutions.

Structural Design

1. Piezoelectric Actuator

High-performance PZT ceramics (high d33 coefficient)
Multi-layer polarization for bidirectional bending
Composite reinforcement layer for durability

2. Airflow Channel

Dual-channel airflow design for higher efficiency
Optimized inlet and outlet geometry
Internal pressure-guided flow path

3. Mechanical Integration

Interference-fit mounting structure
Fully enclosed design for environmental protection
Stress-isolated architecture to extend lifespan

Applications

The Semicera piezoelectric cooling module is widely applicable in:

Ultrabooks and laptops
Solid-state drives (SSD)
Mini PCs and embedded systems
Smartphones and tablets
Wearable devices
AI edge computing hardware

Simulation & Integration Support

At Semicera, we provide engineering support for system-level integration, including:

Thermal simulation (CFD analysis)
Airflow path optimization
PQ curve-based performance evaluation
Customized cooling solutions for specific device layouts

Advantages Over Traditional Fans

Feature	Piezoelectric Module	Traditional Fan
Thickness	Ultra-thin	Bulky
Noise	Silent	Audible
Reliability	No moving parts	Mechanical wear
Back Pressure	High	Moderate
Integration	Flexible	Limited