Product overview
A compact aluminum nitride single-crystal substrate for deep-UV, GaN epitaxy, materials research and process development where wide bandgap, electrical insulation and high thermal conductivity are required.
Key features
- · P, R and D grade options for production, research and experimental use
- · (0001) orientation with ±0.5° tolerance
- · Al-face CMP and N-face mechanical polish
- · Low Al-face surface roughness for epi-oriented evaluation
- · Single-wafer packaging for controlled handling
- · GaN and AlGaN epitaxy development
- · Deep-ultraviolet optoelectronics
- · High-voltage and high-temperature material research
- · Thermal-spreading and dielectric substrate evaluation
- · University and industrial R&D
Typical applications
- · GaN and AlGaN epitaxy development
- · Deep-ultraviolet optoelectronics
- · High-voltage and high-temperature material research
- · Thermal-spreading and dielectric substrate evaluation
- · University and industrial R&D
Technical specification
|
Property |
P Product |
R Research |
D Experimental |
|
Side length |
10 ± 0.5 mm |
10 ± 0.5 mm |
10 ± 0.5 mm |
|
Thickness |
450 ± 25 µm |
450 ± 25 µm |
450 ± 25 µm |
|
Orientation |
(0001) ± 0.5° |
(0001) ± 0.5° |
(0001) ± 0.5° |
|
HR-XRD FWHM (002) |
≤100 arcsec |
≤200 arcsec |
≤300 arcsec |
|
HR-XRD FWHM (102) |
≤80 arcsec |
≤150 arcsec |
≤250 arcsec |
|
Surface |
Al face CMP; N face MP |
Al face CMP; N face MP |
Al face CMP; N face MP |
|
Surface roughness |
Al ≤0.5 nm; N ≤1.2 µm |
Al ≤0.5 nm; N ≤1.2 µm |
Al ≤0.5 nm; N ≤1.2 µm |
|
Visible scratches / chips |
None |
None |
None |
|
Edge exclusion |
1 mm |
1 mm |
1 mm |
|
TTV |
≤15 µm |
≤15 µm |
≤15 µm |
|
Bow |
≤15 µm |
≤15 µm |
≤15 µm |
|
Primary flat |
N/O |
N/O |
N/O |
|
Packaging |
Single-wafer box |
Single-wafer box |
Single-wafer box |
|
Specification note: Values are reproduced from the supplied product specification. Final acceptance criteria, test methods and sampling plan must be confirmed in the quotation or purchase specification. |
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Grade and order selection
1. State the intended application and process temperature or environment.
2. Specify grade, dimensions, orientation or polytype, thickness and surface finish.
3. Define the inspection method, defect limits and required certificate data.
4. Confirm sample quantity, annual demand, packaging and delivery expectations.
Frequently asked questions
Which face is CMP finished?
The Al face is CMP finished; the N face is mechanically polished according to the supplied specification.
How should I select a grade?
Use P grade for the tightest XRD FWHM limits, R grade for research qualification and D grade for experimental screening.
Can other dimensions be discussed?
Please provide target size, orientation, thickness, finish and inspection requirements for feasibility review.
Request a technical review: Send your target specification, drawing or process conditions to sales05@semi-cera.com. Semicera will confirm feasibility and recommend the appropriate grade.
