1-inch AlN Single-Crystal Wafer

Short Description:

1-inch AlN single-crystal wafers with P, R and D grades, (0001) orientation, Al-face CMP, ≥90% usable area and controlled TTV and bow.


Product Detail

Product Tags

Product overview

A one-inch aluminum nitride wafer platform for epitaxy and wide-bandgap research, offered in three grade levels to match different crystal-quality and development needs.

Key features

  • · P and R grades at 25.4 ± 0.5 mm diameter
  • · D grade at 24 ± 1 mm diameter
  • · Al-face CMP with Ra ≤0.5 nm
  • · Usable area ≥90%
  • · Controlled TTV, bow and primary flat orientation

Typical applications

  • · AlN and Al-rich nitride epitaxy
  • · Deep-UV LED and detector research
  • · High-frequency and high-voltage material development
  • · Thermal and dielectric substrate evaluation
  • · Pilot process qualification

Technical specification

Property

P Product

R Research

D Experimental

Diameter

25.4 ± 0.5 mm

25.4 ± 0.5 mm

24 ± 1 mm

Thickness

450 ± 25 µm

450 ± 25 µm

450 ± 25 µm

Orientation

(0001) ± 0.5°

(0001) ± 0.5°

(0001) ± 0.5°

HR-XRD FWHM (002)

≤100 arcsec

≤200 arcsec

≤300 arcsec

HR-XRD FWHM (102)

≤80 arcsec

≤150 arcsec

≤250 arcsec

Surface

Al face CMP; N face MP

Al face CMP; N face MP

Al face CMP; N face MP

Surface roughness

Al ≤0.5 nm; N ≤1.2 µm

Al ≤0.5 nm; N ≤1.2 µm

Al ≤0.5 nm; N ≤1.2 µm

Usable area

≥90%

≥90%

≥90%

Visible scratches / chips

None

None

None

Edge exclusion

1 mm

1 mm

1 mm

TTV

≤20 µm

≤20 µm

≤20 µm

Bow

≤20 µm

≤20 µm

≤20 µm

Primary flat

(10-10) ±5°; 8 ±1 mm

(10-10) ±5°; 8 ±1 mm

(10-10) ±5°; 8 ±1 mm

Packaging

Single-wafer box

Single-wafer box

Single-wafer box

Specification note: Values are reproduced from the supplied product specification. Final acceptance criteria, test methods and sampling plan must be confirmed in the quotation or purchase specification.


Grade and order selection

1. State the intended application and process temperature or environment.

2. Specify grade, dimensions, orientation or polytype, thickness and surface finish.

3. Define the inspection method, defect limits and required certificate data.

4. Confirm sample quantity, annual demand, packaging and delivery expectations.

Frequently asked questions

Is the D-grade diameter identical to P and R?

No. The supplied specification lists 24 ±1 mm for D grade and 25.4 ±0.5 mm for P and R grades.

What is the usable area?

The specification lists ≥90% usable area for all three grades.

Is the wafer epi-ready?

The Al face is CMP finished. Final epi-readiness should be confirmed against the customer’s cleaning, defect and surface-chemistry requirements.


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