Product overview
A two-inch aluminum nitride single-crystal wafer for scaled epitaxy and wide-bandgap material development, with three crystal-quality grades and controlled wafer geometry.
Key features
- · P and R grades at 50.8 ±0.5 mm diameter
- · D grade at 50 ±1 mm diameter
- · Defined (002) and (102) HR-XRD FWHM limits
- · Al-face CMP and ≥90% usable area
- · TTV and bow controlled to ≤30 µm
Typical applications
- · GaN/AlN heteroepitaxy
- · Deep-UV optoelectronic development
- · High-power and high-frequency research
- · Thermal-management substrate evaluation
- · Pilot-line scale-up from small coupons
Technical specification
|
Property |
P Product |
R Research |
D Experimental |
|
Diameter |
50.8 ±0.5 mm |
50.8 ±0.5 mm |
50 ±1 mm |
|
Thickness |
450 ±25 µm |
450 ±25 µm |
450 ±25 µm |
|
Orientation |
(0001) ±0.5° |
(0001) ±0.5° |
(0001) ±0.5° |
|
HR-XRD FWHM (002) |
≤100 arcsec |
≤200 arcsec |
≤300 arcsec |
|
HR-XRD FWHM (102) |
≤80 arcsec |
≤150 arcsec |
≤250 arcsec |
|
Surface |
Al face CMP; N face MP |
Al face CMP; N face MP |
Al face CMP; N face MP |
|
Surface roughness |
Al ≤0.5 nm; N ≤1.2 µm |
Al ≤0.5 nm; N ≤1.2 µm |
Al ≤0.5 nm; N ≤1.2 µm |
|
Usable area |
≥90% |
≥90% |
≥90% |
|
Visible scratches / chips |
None |
None |
None |
|
Edge exclusion |
1 mm |
1 mm |
1 mm |
|
TTV |
≤30 µm |
≤30 µm |
≤30 µm |
|
Bow |
≤30 µm |
≤30 µm |
≤30 µm |
|
Primary flat |
(10-10) ±5°; 16 ±2 mm |
(10-10) ±5°; 16 ±2 mm |
(10-10) ±5°; 16 ±2 mm |
|
Packaging |
Single-wafer box |
Single-wafer box |
Single-wafer box |
|
Specification note: Values are reproduced from the supplied product specification. Final acceptance criteria, test methods and sampling plan must be confirmed in the quotation or purchase specification. |
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Grade and order selection
1. State the intended application and process temperature or environment.
2. Specify grade, dimensions, orientation or polytype, thickness and surface finish.
3. Define the inspection method, defect limits and required certificate data.
4. Confirm sample quantity, annual demand, packaging and delivery expectations.
Frequently asked questions
What is the difference between P, R and D grades?
The main listed difference is the allowable HR-XRD FWHM; P grade has the tightest limits.
What are the wafer geometry limits?
The specification lists TTV ≤30 µm and bow ≤30 µm for all grades.
Can the flat orientation be customized?
The listed standard is (10-10) ±5° with a 16 ±2 mm flat. Alternative requirements need engineering review.
